Thin Film Chip Resistor
M55342/09 RM2512
04/09/08
PERFORMANCE
MECHANICAL
“Specifications subject to change without notice.”“Specifications subject to change without notice.”
Resistance Range 5 - 1M
Tolerances 0.1%, 1%, 2%, 5%
Maximum Power 1000 mW
Maximum Voltage 200 Volts
WWResistance Range 5-1M
Tolerances 0.1%, 1%, 2%, 5%
Maximum Power 1000 mW
Maximum Voltage 200 Volts
WW
PART NUMBERING
M55342 H 09 B 100DR-TRM55342 H 09 B 100D R - TR
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppmTEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342PERFORMANCE SPECIFICATION MIL-PRF-55342
TERMINATION MATERIALS: B: Solderable wraparound W: Gold wire bondableTERMINATION MATERIALS: B: Solderable wraparound W: Gold wire bondable
SIZE CODE: /09 = RM2512SIZE CODE: /09 = RM2512
RESISTANCEAND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
RESISTANCEAND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ERPRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
A: 0.1%
B: 0.1% K
C: 0.1% M
W
W
W
A: 0.1%
B: 0.1% K
C: 0.1% M
W
W
W
PACKAGING CODE: TR = Tape & Reel W= Waffle PackPACKAGING CODE: TR = Tape & Reel W= Waffle Pack
2470 Fox Hill Road, State College, PA 16803-17972470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401Toll Free 1-800-458-3401
www.resistor.comwww.resistor.com
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
TESTS
TCR (-55 to +125 C) in ppm/ C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
°°
TESTS
TCR (-55 to +125 C) in ppm/ C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
°°
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
H
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
H
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
CHARACTERISTICS*
StateoftheArt,Inc.
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
.300
.125
.202
.049
PROTECTIVE
ENCAPSULANT
PROTECTIVE
ENCAPSULANT
WRAPAROUND
TERMINATIONS
PRETINNED
WRAPAROUND
TERMINATIONS
PRETINNED
99.6% ALUMINA CHIP99.6% ALUMINA CHIP
PRECISION
THIN FILM
RESISTOR
PRECISION
THIN FILM
RESISTOR
LIFE TEST POWER DERATING
TEMPERATURE RISE (°C)
POWER DISSIPATION
POWER DISSIPATION (WATTS)
fiber epoxy board
ceramic board
CURRENT NOISE
D: 1%
E: 1% K
F: 1% M
W
W
W
D: 1%
E: 1% K
F: 1% M
W
W
W
G: 2%
H: 2% K
T: 2% M
W
W
W
G: 2%
H: 2% K
T: 2% M
W
W
W
J: 5%
K: 5% K
L: 5% M
W
W
W
J: 5%
K: 5% K
L: 5% M
W
W
W
INCHES MILLIMETERSINCHES MILLIMETERS
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.250 (.244 - .268)
.119 (.119 - .129)
.028 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.212 (.208 - .216)
.0513 grams
.250 (.244 - .268)
.119 (.119 - .129)
.028 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.212 (.208 - .216)
.0513 grams
6.35 (6.20 - 6.81)
3.02 (3.02 - 3.28)
0.71 (0.38 - 0.84)
0.51 (0.38 - 0.64)
0.48 (0.38 - 0.64)
5.39 (5.28 - 5.49)
6.35 (6.20 - 6.81)
3.02 (3.02 - 3.28)
0.71 (0.38 - 0.84)
0.51 (0.38 - 0.64)
0.48 (0.38 - 0.64)
5.39 (5.28 - 5.49)
