SLLS348M - JUNE 1999 - REVISED MARCH 2004 D RS-232 Bus-Pin ESD Protection Exceeds D D D D D D D D D D DB OR PW PACKAGE (TOP VIEW) 15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s One Driver and One Receiver Low Standby Current . . . 1 A Typical External Capacitors . . . 4 x 0.1 F Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbit/s) - SNx5C3221 Auto-Powerdown Feature Automatically Disables Drivers for Power Savings Applications - Battery-Powered, Hand-Held, and Portable Equipment - PDAs and Palmtop PCs - Notebooks, Subnotebooks, and Laptops - Digital Cameras - Mobile Phones and Wireless Devices EN C1+ V+ C1- C2+ C2- V- RIN 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 FORCEOFF VCC GND DOUT FORCEON DIN INVALID ROUT description/ordering information The MAX3221 consists of one line driver, one line receiver, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/s driver output slew rate. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE TA SSOP (DB) -0C to 70C TSSOP (PW) SSOP (DB) -40C to 85C TSSOP (PW) Tube of 80 MAX3221CDB Reel of 2000 MAX3221CDBR Tube of 90 MAX3221CPW Reel of 2000 MAX3221CPWR Tube of 80 MAX3221IDB Reel of 2000 MAX3221IDBR Tube of 90 MAX3221IPW Reel of 2000 MAX3221IPWR TOP-SIDE MARKING MA3221C MA3221C MB3221I MB3221I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"#$%! & '("")% $& ! *(+,'$%! -$%) "!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%& &%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-) %)&%2 ! $,, *$"$#)%)"& POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SLLS348M - JUNE 1999 - REVISED MARCH 2004 description/ordering information (continued) Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled. If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is reduced to 1 A. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high (valid data) if the receiver input voltage is greater than 2.7 V or less than -2.7 V, or has been between -0.3 V and 0.3 V for less than 30 s. INVALID is low (invalid data) if the receiver input voltage is between -0.3 V and 0.3 V for more than 30 s. Refer to Figure 5 for receiver input levels. Function Tables EACH DRIVER INPUTS OUTPUT DOUT DRIVER STATUS X Z Powered off Normal operation with auto-powerdown disabled DIN FORCEON FORCEOFF VALID RIN RS-232 LEVEL X X L L H H X H H H H X L L L H Yes H H L H Yes L L L H No Z H L H No Z Normal operation with auto-powerdown enabled Powered off by auto-powerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance EACH RECEIVER INPUTS RIN EN VALID RIN RS-232 LEVEL OUTPUT ROUT L L X H H L X L X H X Z Open L No H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = disconnected input or connected driver off 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS348M - JUNE 1999 - REVISED MARCH 2004 logic diagram (positive logic) DIN FORCEOFF FORCEON ROUT 11 13 DOUT 16 12 10 Auto-powerdown 8 9 1 INVALID RIN EN absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 7 V Negative output supply voltage range, V- (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to -7 V Supply voltage difference, V+ - V- (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V Input voltage range, VI: Driver (FORCEOFF, FORCEON, EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25 V to 25 V Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -13.2 V to 13.2 V Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VCC + 0.3 V Package thermal impedance, JA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4 and Figure 6) Supply voltage VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON, EN VIL VI Driver and control low-level input voltage DIN, FORCEOFF, FORCEON, EN Driver and control input voltage DIN, FORCEOFF, FORCEON VI Receiver input voltage Operating free-air temperature NOM MAX 3 3.3 3.6 4.5 5 5.5 VCC = 3.3 V VCC = 5 V 2.4 MAX3221C TA MIN VCC = 3.3 V VCC = 5 V MAX3221I UNIT V 2 V 0.8 V 0 5.5 V -25 25 V 0 70 -40 85 C NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SLLS348M - JUNE 1999 - REVISED MARCH 2004 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER II Input leakage current TEST CONDITIONS FORCEOFF, FORCEON, EN Auto-powerdown disabled ICC Supply current MIN VCC = 3.3 V or 5 V, TA = 25C Powered off Auto-powerdown enabled No load, FORCEOFF and FORCEON at VCC No load, FORCEOFF at GND No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded TYP MAX 0.01 1 A 0.3 1 mA 1 10 1 10 UNIT A All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage DOUT at RL = 3 k to GND, DIN = GND 5 5.4 V VOL Low-level output voltage DOUT at RL = 3 k to GND, DIN = VCC -5 -5.4 V IIH IIL High-level input current Low-level input current VI = VCC VI at GND IOS Short-circuit output current VCC = 3.6 V, VCC = 5.5 V, ro Output resistance VCC, V+, and V- = 0 V, Ioff Output leakage current FORCEOFF = GND 0.01 1 A 0.01 1 A 35 60 35 60 VO = 0 V VO = 0 V VO = 2 V VO = 12 V, VCC = 3 V to 3.6 V 25 VO = 10 V, VCC = 4.5 V to 5.5 V 25 300 mA 10M A All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER tsk(p) SR(tr) TEST CONDITIONS MIN TYP 150 250 CL = 1000 pF, RL = 3 k, See Figure 1 CL = 150 pF to 2500 pF, RL = 3 k to 7 k, See Figure 2 Slew rate, transition region (see Figure 1) VCC = 3.3 V, RL = 3 k to 7 k CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 UNIT kbit/s 100 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. 4 MAX Maximum data rate Pulse skew ns V/s SLLS348M - JUNE 1999 - REVISED MARCH 2004 ESD protection TERMINAL NAME NO. DOUT 13 TEST CONDITIONS HBM TYP UNIT 15 kV RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER VOH VOL TEST CONDITIONS High-level output voltage IOH = -1 mA IOL = 1.6 mA Low-level output voltage VIT+ Positive-going input threshold voltage VCC = 3.3 V VCC = 5 V VIT- Negative-going input threshold voltage VCC = 3.3 V VCC = 5 V Vhys Ioff Input hysteresis (VIT+ - VIT-) TYP MIN VCC-0.6 MAX VCC-0.1 V 0.4 1.6 2.4 1.9 2.4 0.6 1.1 0.8 1.4 0.05 FORCEOFF = 0 V ri Input resistance VI = 3 V to 25 V 3 5 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. V V V 0.5 Output leakage current UNIT V 10 A 7 k switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH tPHL Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 150 ns Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns ten tdis Output enable time CL = 150 pF, RL = 3 k, See Figure 4 200 ns Output disable time CL = 150 pF, RL = 3 k, See Figure 4 200 tsk(p) Pulse skew See Figure 3 50 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. NOTE 4: Test conditions are C1-C4 = 0.1 F at VCC = 3.3 V 0.3 V; C1 = 0.047 F, C2-C4 = 0.33 F at VCC = 5 V 0.5 V. ns ns ESD protection TERMINAL NAME RIN TEST CONDITIONS NO. 8 HBM POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TYP UNIT 15 kV 5 SLLS348M - JUNE 1999 - REVISED MARCH 2004 AUTO-POWERDOWN SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT-(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC -2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC -0.3 VOH INVALID high-level output voltage IOH = -1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC MAX 2.7 UNIT V V 0.3 VCC-0.6 V V 0.4 V switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER tvalid tinvalid MIN MAX UNIT Propagation delay time, low- to high-level output 1 s Propagation delay time, high- to low-level output 30 s 100 s ten Supply enable time All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25C. 6 TYP POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS348M - JUNE 1999 - REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 RL tTHL CL (see Note A) 3V FORCEOFF TEST CIRCUIT 0V tTLH -3 V -3 V 6V SR(tr) + t THL or t TLH VOH 3V 3V Output VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 2. Driver Pulse Skew 3 V or 0 V FORCEON 3V Input 1.5 V 1.5 V -3 V Output Generator (see Note B) 50 3V FORCEOFF tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 3. Receiver Propagation Delay Times POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SLLS348M - JUNE 1999 - REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 3V Input 3 V or 0 V FORCEON VCC S1 1.5 V GND 0V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V VOH Output 50% Output CL (see Note A) EN Generator (see Note B) 50 0.3 V tPZL (S1 at VCC) tPLZ (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLLS348M - JUNE 1999 - REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 2.7 V 2.7 V 0V Receiver Input 0V ROUT Generator (see Note B) 3V -2.7 V -2.7 V 50 -3 V tvalid tinvalid VCC Autopowerdown INVALID CL = 30 pF (see Note A) FORCEOFF FORCEON DIN DOUT 50% VCC INVALID Output 50% VCC 0V ten V+ V+ 0.3 V VCC 0V 0.3 V Supply Voltages V- V- TEST CIRCUIT VOLTAGE WAVEFORMS IIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIII Valid RS-232 Level, INVALID High 2.7 V Indeterminate 0.3 V 0V If Signal Remains Within This Region For More Than 30 s, INVALID Is Low -0.3 V Indeterminate -2.7 V Valid RS-232 Level, INVALID High Auto-powerdown disables drivers and reduces supply current to 1 A. NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 5. INVALID Propagation Delay Times and Driver Enabling Time POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 SLLS348M - JUNE 1999 - REVISED MARCH 2004 APPLICATION INFORMATION EN 1 16 2 VCC C1+ 15 + 3 C1 + + - - V+ Autopowerdown C3 4 GND - 14 6 C2- 7 - RIN 12 C2 11 V- 10 C4 + DOUT C2+ + - CBYPASS = 0.1 F C1- 13 5 FORCEOFF 8 9 FORCEON DIN INVALID ROUT 5 k C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V 0.3 V 5 V 0.5 V 3 V to 5.5 V 0.1 F 0.047 F 0.1 F 0.1 F 0.33 F 0.47 F Figure 6. Typical Operating Circuit and Capacitor Values 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3221CDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3221IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MAX3221 : * Enhanced Product: MAX3221-EP NOTE: Qualified Version Definitions: * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 MAX3221CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 MAX3221CPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 MAX3221IDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 MAX3221IPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3221CDBR SSOP DB 16 2000 346.0 346.0 33.0 MAX3221CPWR TSSOP PW 16 2000 346.0 346.0 29.0 MAX3221IDBR SSOP DB 16 2000 346.0 346.0 33.0 MAX3221IPWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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