ON
OFF
C = 1 F
IN µ
GND
VIN
CL
GND
RL
CL
VOUT
SMPS
GND
LOAD
TPS22924B
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
ULTRA-SMALL, LOW-INPUT-VOLTAGE, LOW r
ON
LOAD SWITCH
Check for Samples: TPS22924B
1FEATURES DESCRIPTION
•Integrated Single Load Switch The TPS22924B is a small, ultra-low rON load switch
•Input Voltage: 0.75 V to 3.6 V with controlled turn on. The device contains a
•Ultra-Low ON Resistance N-channel MOSFET that can operate over an input
–rON = 18.3 mΩat VIN = 3.6 V voltage range of 0.75 V to 3.6 V. An integrated
–rON = 18.5 mΩat VIN = 2.5 V charge pump biases the NMOS switch to achieve a
minimum switch ON resistance. The switch is
–rON = 19.6 mΩat VIN = 1.8 V controlled by an on/off input (ON), which is capable of
–rON = 19.4 mΩat VIN = 1.2 V interfacing directly with low-voltage control signals.
–rON = 20.3 mΩat VIN = 1.0 V A 1250-Ωon-chip load resistor is added for output
–rON = 22.7 mΩat VIN = 0.75 V quick discharge when the switch is turned off. The
•Ultra Small CSP-6 package rise time of the device is internally controlled to avoid
0.9 mm x 1.4 mm, 0.5-mm Pitch inrush current. The TPS22924B features a rise time
•2-A Maximum Continuous Switch Current of 100 µs at 3.6 V.
•Low Shutdown Current The TPS22924B is available in an ultra-small
•Low Threshold Control Input space-saving 6-pin CSP package and is
•Controlled Slew Rate to Avoid Inrush Currents characterized for operation over the free-air
temperature range of –40ºC to 85ºC.
•Quick Output Discharge Transistor
•ESD Performance Tested Per JESD 22 Figure 1. TYPICAL APPLICATION
–5000-V Human-Body Model
(A114-B, Class II)
–1000-V Charged-Device Model (C101)
APPLICATIONS
•Battery Powered Equipment NOTE: SMPS = Switched-mode power supply
•Portable Industrial Equipment
•Portable Medical Equipment
•Portable Media Players
•Point Of Sales Terminal
•GPS Devices
•Digital Cameras
•Notebooks / Tablet PCs / eReaders
•Smartphones
Table 1. FEATURE LIST
SLEW RATE QUICK MAXIMUM
rON (TYP) (TYP) OUTPUT OUTPUT ENABLE
AT 3.6 V AT 3.6 V DISCHARGE(1) CURRENT
TPS22924B 18.3 mΩ100 μs Yes 2 A Active high
(1) This feature discharges the output of the switch to ground through a 1250-Ωresistor, preventing the
output from floating. See the Output Pulldown section in Application Information.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright ©2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Laser Marking View Bump View
C
B
2 1
A
C
B
1 2
A
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
–40°C to 85°C DSBGA –YZ (0.5-mm pitch) Tape and reel TPS22924BYZR ___5N_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
YZ PACKAGE
TERMINALS ASSIGNMENTS (YZ PACKAGE)
C GND ON
B VOUT VIN
A VOUT VIN
1 2
TERMINAL FUNCTIONS
NO. NAME DESCRIPTION
C1 GND Ground
C2 ON Switch control input, active high. Do not leave floating
A1, B1 VOUT Switch output
A2, B2 VIN Switch input, bypass this input with a ceramic capacitor to ground
2Copyright ©2011, Texas Instruments Incorporated
ON
VOUT
GND
VIN
Control
Logic
Charge
Pump
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
BLOCK DIAGRAM
FUNCTION TABLE
ON (Control Signal) VIN to VOUT VOUT to GND(1)
L OFF ON
H ON OFF
(1) See application section Output Pulldown.
Copyright ©2011, Texas Instruments Incorporated 3
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
MIN MAX UNIT
VIN Input voltage range –0.3 4 V
VOUT Output voltage range VIN + 0.3 V
VON Input voltage range –0.3 4 V
IMAX Maximum continuous switch current, TA= -40°C to 85°C 2 A
IPLS Maximum pulsed switch current, 100-µs pulse, 2% duty cycle, TA= -40°C to 85°C 4 A
TAOperating free-air temperature range –40 85 °C
Tstg Storage temperature range –65 150 °C
Human-Body Model (HBM) 5000
ESD Electrostatic discharge protection V
Charged-Device Model (CDM) 1000
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS DERATING
FACTOR
BOARD PACKAGE RθJC RθJA TA<25°C TA= 70°C TA= 85°C
ABOVE
TA= 25°C
- 8.1063
High-K(1) YZ 17.6°C/W 123.36°C/W 810.63 mW 445.84 mW 324.25 mW
mW/°C
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3- ×3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
VIN Input voltage 0.75 3.6 V
VOUT Output voltage VIN V
VIN = 2.5 V to 3.6 V 1.2 3.6
VIH High-level input voltage, ON V
VIN = 0.75 V to 2.5 V 0.9 3.6
VIN = 2.5 V to 3.6 V 0.6
VIL Low-level input voltage, ON V
VIN = 0.75 V to 2.49 V 0.4
CIN Input capacitance 1(1) μF
(1) See the Input Capacitor section in Application Information.
4Copyright ©2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
ELECTRICAL CHARACTERISTICS
VIN = 0.75 V to 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP(1) MAX UNIT
VIN = 3.6 V 75 160
VIN = 2.5 V 42 70
VIN = 1.8 V 50 350
IIN Quiescent current IOUT = 0, VIN = VON Full µA
VIN = 1.2 V 95 200
VIN = 1.0 V 65 110
VIN = 0.75 V 35 70
IIN(LEAK) OFF-state supply current VON = GND, OUT = 0V Full 3.5 µA
25°C 18.3 19.7
VIN = 3.6 V Full 26.0
25°C 18.5 19.5
VIN = 2.5 V Full 25.8
25°C 19.6 21.8
VIN = 1.8 V Full 27.4
rON ON-state resistance IOUT = -200 mA mΩ
25°C 19.4 21.8
VIN = 1.2 V Full 28.0
25°C 20.3 21.2
VIN = 1.0 V Full 28.6
25°C 22.7 25.3
VIN = 0.75 V Full 34.8
Output pulldown
rPD VIN = 3.3 V, VON = 0, IOUT = 3 mA 25°C 1250 1500 Ω
resistance(2)
ON-state input leakage
ION VON = 0.9 V to 3.6 V or GND Full 0.1 µA
current
(1) Typical values are at VIN = 3.3 V and TA= 25°C.
(2) See Output Pulldown in Application Information.
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL= 10 Ω, CL= 0.1 μF, VIN = 3.6V 111 μs
tOFF Turn-OFF time RL= 10 Ω, CL= 0.1 μF, VIN = 3.6V 3 μs
trVOUT rise time RL= 10 Ω, CL= 0.1 μF, VIN = 3.6V 96 μs
tfVOUT fall time RL= 10 Ω, CL= 0.1 μF, VIN = 3.6V 2.5 μs
SWITCHING CHARACTERISTICS
VIN = 0.9 V, TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL= 10 Ω, CL= 0.1 μF, VIN = 0.9V 160 μs
tOFF Turn-OFF time RL= 10 Ω, CL= 0.1 μF, VIN = 0.9V 20 μs
trVOUT rise time RL= 10 Ω, CL= 0.1 μF, VIN = 0.9V 81 μs
tfVOUT fall time RL= 10 Ω, CL= 0.1 μF, VIN = 0.9V 5 μs
Copyright ©2011, Texas Instruments Incorporated 5
90% 90%
VOUT
trtf
10%10%
50%
VOUT
50%
50%
50%
VON
tON
tOFF
TEST CIRCUIT
t /t WAVEFORMS
ON OFF
ON
(A)
OFF TPS22924B
GND
GND
RL
CL
VOUT
VIN
+
–
CIN =1 Fμ
GND
ON
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
PARAMETER MEASURMENT INFORMATION
Figure 2. Test Circuit and tON/tOFF Waveforms
6Copyright ©2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE ON-STATE RESISTANCE
vs vs
INPUT VOLTAGE TEMPERATURE
INPUT CURRENT, QUIESCENT INPUT CURRENT, LEAK
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Copyright ©2011, Texas Instruments Incorporated 7
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
ON INPUT THRESHOLD
TURN-ON TIME TURN-OFF TIME
vs vs
TEMPERATURE TEMPERATURE
VIN = 3.6 V, CL= 0.1 µF, RL= 10 ΩVIN = 3.6 V, CL= 0.1 µF, RL= 10 Ω
8Copyright ©2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
TYPICAL CHARACTERISTICS (continued)
RISE TIME FALL TIME
vs vs
TEMPERATURE TEMPERATURE
VIN = 3.6 V, CL= 0.1 µF, RL= 10 ΩVIN = 3.6 V, CL= 0.1 µF, RL= 10 Ω
TURN-ON TIME TURN-OFF TIME
vs vs
TEMPERATURE TEMPERATURE
VIN = 0.9 V, CL= 0.1 µF, RL= 10 ΩVIN = 0.9 V, CL= 0.1 µF, RL= 10 Ω
Copyright ©2011, Texas Instruments Incorporated 9
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
RISE TIME FALL TIME
vs vs
TEMPERATURE TEMPERATURE
VIN = 0.9 V, CL= 0.1 µF, RL= 10 ΩVIN = 0.9 V, CL= 0.1 µF, RL= 10 Ω
RISE TIME RISE TIME
vs vs
INPUT VOLTAGE INPUT VOLTAGE
CL= 0.1 µF, RL= 10 Ω, VON = 1.8 V CL= 20 µF, RL= 10 Ω, VON = 1.8 V
10 Copyright ©2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE TURN-OFF RESPONSE
CIN = 1 µF, CL= 0.1 µF, RL= 10 Ω, VIN = 0.9 V, TA= 25°C CIN = 1 µF, CL= 0.1 µF, RL= 10 Ω, VIN = 0.9 V, TA= 25°C
TURN-ON RESPONSE TURN-OFF RESPONSE
CIN = 47 µF, CL= 20 µF, RL= 10 Ω, VIN = 0.9 V, TA= 25°C CIN = 47 µF, CL= 20 µF, RL= 10 Ω, VIN = 0.9 V, TA= 25°C
TURN-ON RESPONSE TURN-OFF RESPONSE
CIN = 1 µF, CL= 0.1 µF, RL= 10 Ω, VIN = 3.6 V, TA= 25°C CIN = 1 µF, CL= 0.1 µF, RL= 10 Ω, VIN = 3.6 V, TA= 25°C
Copyright ©2011, Texas Instruments Incorporated 11
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE TURN-OFF RESPONSE
CIN = 47 µF, CL= 20 µF, RL= 10 Ω, VIN = 3.6 V, TA= 25°C CIN = 47 µF, CL= 20 µF, RL= 10 Ω, VIN = 3.6 V, TA= 25°C
12 Copyright ©2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
Due to the integral body diode in the NMOS switch, a CIN greater than CLis highly recommended. A CLgreater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.ACIN to CLratio of 10 to 1 is recommended for minimizing VIN dip
caused by inrush currents during startup.
Output Pulldown
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, then the output pulldown is automatically disconnected to optimize
the shutdown current.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
Copyright ©2011, Texas Instruments Incorporated 13
PACKAGE OPTION ADDENDUM
www.ti.com 21-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS22924BYZR ACTIVE DSBGA YZ 6 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
TPS22924BYZT ACTIVE DSBGA YZ 6 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS22924BYZR DSBGA YZ 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS22924BYZR DSBGA YZ 6 3000 220.0 220.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Aug-2012
Pack Materials-Page 2
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