SN74CBTD3306 DUAL FET BUS SWITCH WITH LEVEL SHIFTING SCDS030L - JANUARY 1996 - REVISED JANUARY 2004 D 5- Switch Connection Between Two Ports D TTL-Compatible Input Levels D Designed to Be Used in Level-Shifting D OR PW PACKAGE (TOP VIEW) 1OE 1A 1B GND Applications description/ordering information 1 8 2 7 3 6 4 5 VCC 2OE 2B 2A The SN74CBTD3306 features two independent line switches. Each switch is disabled when the associated output-enable (OE) input is high. A diode to VCC is integrated on the chip to allow for level shifting from 5-V signals at the device inputs to 3.3-V signals at the device outputs. ORDERING INFORMATION TA PACKAGE ORDERABLE PART NUMBER Tube SN74CBTD3306D Tape and reel SN74CBTD3306DR Tube SN74CBTD3306PW Tape and reel SN74CBTD3306PWR SOIC - D -40C 40C to 85C TSSOP - PW TOP-SIDE MARKING CC306 CC306 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each bus switch) INPUT OE FUNCTION L A port = B port H Disconnect logic diagram (positive logic) 1A 1OE 2 3 1B 1 5 6 2A 2B 7 2OE Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright (c) 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN74CBTD3306 DUAL FET BUS SWITCH WITH LEVEL SHIFTING SCDS030L - JANUARY 1996 - REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage TA Operating free-air temperature MIN MAX 4.5 5.5 2 -40 UNIT V V 0.8 V 85 C In applications with fast edge rates, multiple outputs switching, and operating at high frequencies, the output may have little or no level-shifting effect. NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VCC = 4.5 V, VOH See Figure 2 II VCC = 5.5 V, VI = 5.5 V or GND ICC MIN TYP II = -18 mA MAX UNIT -1.2 V 1 A VCC = 5.5 V, IO = 0, VI = VCC or GND 1.5 mA ICC Control inputs VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 2.5 mA Ci Control inputs VI = 3 V or 0 Cio(OFF) ron VO = 3 V or 0, VCC = 4.5 V 3 OE = VCC VI = 0 VI = 2.4 V, pF 4 pF II = 64 mA 5 7 II = 30 mA 5 7 II = 15 mA 35 50 All typical values are at VCC = 5 V, TA = 25C. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V CC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74CBTD3306 DUAL FET BUS SWITCH WITH LEVEL SHIFTING SCDS030L - JANUARY 1996 - REVISED JANUARY 2004 switching characteristics over recommended ranges of supply voltage and operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A or B B or A ten OE A or B tdis OE A or B MIN MAX UNIT 0.25 ns 2.1 5.4 ns 1 4.7 ns The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). PARAMETER MEASUREMENT INFORMATION 500 From Output Under Test S1 7V Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 50 pF (see Note A) S1 Open 7V Open 500 3V Output Control LOAD CIRCUIT 1.5 V 0V tPZL 3V 1.5 V Input 1.5 V 0V tPLH VOH Output 1.5 V Output Waveform 1 S1 at 7 V (see Note B) tPLZ 3.5 V 1.5 V tPZH tPHL 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 1.5 V VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH - 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN74CBTD3306 DUAL FET BUS SWITCH WITH LEVEL SHIFTING SCDS030L - JANUARY 1996 - REVISED JANUARY 2004 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE 4 4 3.75 100 A 3.75 3.5 6 mA 12 mA 3.5 3.25 24 mA 3 2.75 2.5 2.25 2 1.75 1.5 4.5 VOH - Output Voltage High - V VOH - Output Voltage High - V TA = 85C TA = 25C 100 A 6 mA 12 mA 24 mA 3.25 3 2.75 2.5 2.25 2 1.75 4.75 5 5.25 5.5 5.75 1.5 4.5 4.75 VCC - Supply Voltage - V 5 VCC - Supply Voltage - V OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE 4 TA = 0C VOH - Output Voltage High - V 3.75 3.5 100 A 3.25 6 mA 12 mA 3 24 mA 2.75 2.5 2.25 2 1.75 1.5 4.5 4.75 5 5.25 VCC - Supply Voltage - V Figure 2. VOH Values 4 5.25 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5.5 5.75 5.5 5.75 PACKAGE OPTION ADDENDUM www.ti.com 15-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74CBTD3306D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306PWLE OBSOLETE TSSOP PW 8 TBD Call TI SN74CBTD3306PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3306PWRG3 PREVIEW TSSOP PW 8 2000 SN74CBTD3306PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) TBD Lead/Ball Finish Call TI CU NIPDAU MSL Peak Temp (3) Call TI Call TI Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Mar-2010 reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74CBTD3306DR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN74CBTD3306DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN74CBTD3306PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 SN74CBTD3306PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 SN74CBTD3306PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBTD3306DR SOIC D 8 2500 340.5 338.1 20.6 SN74CBTD3306DR SOIC D 8 2500 367.0 367.0 35.0 SN74CBTD3306PWR TSSOP PW 8 2000 367.0 367.0 35.0 SN74CBTD3306PWR TSSOP PW 8 2000 364.0 364.0 27.0 SN74CBTD3306PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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