© Semiconductor Components Industries, LLC, 2007
October, 2007 − Rev. 3 1Publication Order Number:
MBRS140LT3/D
MBRS140LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Low Forward Voltage Drop
Pb−Free Package is Available
Mechanical Characteristics:
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (Approximately)
Cathode Polarity Band
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40 V
Average Rectified Forward Current
(At Rated VR, TC = 110°C) IO1.0 A
Peak Repetitive Forward Current (At Rated
VR, Square Wave, 100 kHz, TC = 110°C) IFRM 2.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM 40 A
Storage / Operating Case Temperature Tstg, TC−55 to +150 °C
Operating Junction Temperature TJ−55 to +125 °C
Voltage Rate of Change
(Rated VR, TJ = 25°C) dv/dt 10,000 V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device Package Shipping
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
MBRS140LT3 SMB 2500/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE − 40 VOLTS
MARKING DIAGRAM
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B14L = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= Pb−Free Package
AYWW
B14LG
G
(Note: Microdot may be in either location)
MBRS140LT3G SMB
(Pb−Free) 2500/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
MBRS140LT3
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Lead (Note 1) RqJL 24 °C/W
Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 80 °C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol TJ = 25°C TJ = 125°C Unit
Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A)
see Figure 2 (iF = 2.0 A)
vF0.5
0.6 0.425
0.58 V
Maximum Instantaneous Reverse Current (Note 3) (VR = 40 V
)
see Figure 4 (VR = 20 V
)
IR
TJ = 25°C TJ = 100°C
mA
0.4
0.02 10
5.0
3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%.
MBRS140LT3
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Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
Figure 5. Current Derating Figure 6. Forward Power Dissipation
0.70.1
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
1.0
400
VR, REVERSE VOLTAGE (VOLTS)
100E−3
10E−3
1.0E−3
100E−6
10E−6
1.0E−6
45 8525
TL, LEAD TEMPERATURE (°C)
1.6
0.8
0.4
0
IO, AVERAGE FORWARD CURRENT (AMPS)
0.2 0.80
0.9
0.8
0.6
0.5
0.2
0
65
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)I
0.1
0.3 0.5 0.9
10 20 30
, AVERAGE FORWARD CURRENT (AMPS)IO
125105 0.4 1.60.6
0.3
PFO, AVERAGE POWER DISSIPATION (WATTS)
100
TJ = 125°C
100°C
25°C
−40 °C
0.70.1
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
1.0
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
0.1
0.3 0.5 0.9
100
TJ = 125°C
100°C
25°C
, REVERSE CURRENT (AMPS)
R
400
VR, REVERSE VOLTAGE (VOLTS)
100E−3
10E−3
1.0E−3
100E−6
10E−6
1.0E−6
I
10 20 30
, MAXIMUM REVERSE CURRENT (AMPS)
R
1.2
FREQ = 20 kHz
TJ = 125°C
100°C
25°C
TJ = 125°C
100°C
25°C
dc
SQUARE WAVE
Ipk/Io = p
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
dc
SQUARE WAVE
Ipk/Io = p
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
1.4
0.6
0.2
1.0
1.41.0 1.2
0.1
0.4
0.7
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Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating
*
Figure 9. Thermal Response, Junction−to−Lead
Figure 10. Thermal Response, Junction−to−Ambient
300
VR, REVERSE VOLTAGE (VOLTS)
1000
100
10
VR, DC REVERSE VOLTAGE (VOLTS)
25 400
105
85
75
65
C, CAPACITANCE (pF)
T
155.0 10 20 25 35 40 30 355.0 10 2015
95
115
125
, DERATED OPERATING TEMPERATURE ( C)
J°
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
Rtja = 94°C/W
44°C/W 63°C/W
80°C/W
24°C/W
TJ = 25°C
0.10.00001
t, TIME (s)
1.0E+00
1.0E−01
1.0E−02
1.0E−03
1.0E−04
R
0.0001 0.001 0.01
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
T
1.0 10 100 1000
50%
20%
10%
5.0%
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
0.10.00001
t, TIME (s)
1.0E+00
1.0E−01
1.0E−02
1.0E−03
1.0E−04
0.0001 0.001 0.01 1.0 10 100 1000
50%
20%
10%
5.0%
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
R , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
T
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PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE F
E
bD
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
AMIN NOM MAX MIN
MILLIMETERS
1.90 2.13 2.45 0.075
INCHES
A1 0.05 0.10 0.20 0.002
b1.96 2.03 2.20 0.077
c0.15 0.23 0.31 0.006
D3.30 3.56 3.95 0.130
E4.06 4.32 4.60 0.160
L0.76 1.02 1.60 0.030
0.084 0.096
0.004 0.008
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205 0.214 0.220
HE
0.51 REF 0.020 REF
D
L1
HE
2.261
0.089
2.743
0.108
2.159
0.085 ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
MBRS140LT3/D
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