ASMT-MxK0 MoonstoneTM 1W Power LED Light Source on MCPCB Data Sheet Description Features 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. * Available in Red, Amber, Green, Blue, Cool White and Warm White color. The 1W Power LED light source is mounted on to metal core PCB enabling optimum heat dissipation and ease of installation. * Energy efficient * High current operation. * Long operation life. * Wide viewing angle. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. * Silicone encapsulation Applications * AllnGaP Technology for Red and Amber * Portable (flash light, bicycle head light) * InGaN Technology for Green, Blue, Cool White and Warm White color * Reading light * Architectural lighting * Garden lighting * Decorative lighting Specifications * 2.4V, 350mA (typical) for AlInGaP Technology * 3.6V, 350 mA (typical) for InGaN Technology * 110 viewing angle for White Products * 120 viewing angle for Mono color Products Package Dimensions Notes: 1. All dimensions in millimeters 2. Tolerance is 0.1mm unless otherwise specified. Device Selection Guide at Junction Temperature Tj = 25C Luminous Flux, v[1,2,3] (lm) Test Current Color Part Number Min Typ Max (mA) Dice Technology Red ASMT-MRK0 25.5 40.0 56.0 350 AlInGaP Amber ASMT-MAK0 25.5 35.0 43.0 350 AlInGaP Green ASMT-MGK0 43.0 60.0 73.0 350 InGaN Blue ASMT-MBK0 11.5 15.0 25.5 350 InGaN Cool White ASMT-MWK0 43.0 60.0 73.0 350 InGaN Warm White ASMT-MYK0 43.0 50.0 73.0 350 InGaN Notes: 1. V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is 10 % 3. V data are only applicable for ASMT-Mx00 component level device only. Part Numbering System ASMT- M x KO -x1 x2 x3 Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Color B G WY- Blue Green Cool White Warm White Absolute Maximum Ratings[4] at TA = 25C Parameters ASMT - Mx KO Units DC Forward Current [5] 350 mA Peak Pulsing Current [6] 500 mA Power Dissipation for AllnGaP 1050 mW Power Dissipation for InGaN 1400 mW LED Junction Temperature for AllnGaP 120 C LED Junction Temperature for InGaN 110 C Operating Ambient Temperature Range -40 to + 85 C Storage Temperature Range -40 to + 100 C Note: 4. Absolute Maximum Rating data are only applicable for ASMT-Mx00 component level device only. 5. DC forward current - derate linearly based on Figure 5 for AlInGaP & Figure 11 for InGaN. 6. Pulse condition duty factor = 10%, Frequency = 1kHz. Optical Characteristics[1] (TA = 25 C) Peak Wavelength PEAK (nm) Dominant Wavelength D [2] (nm) Viewing Angle 21/2[3] (Degrees) Luminous Efficiency (lm/W) Part Number Color Typ. Typ. Typ. Typ. ASMT-MRK0 Red 635 625 120 48 ASMT-MAK0 Amber 598 590 120 42 ASMT-MGK0 Green 519 525 120 48 ASMT-MBK0 Blue 460 467 120 12 Correlated Color Temperature, CCT (Kelvin) Viewing Angle 21/2 [2] (Degrees) Luminous Efficiency (lm/W) Part Number Color Min Max Typ Typ ASMT-MWK0 Cool White 4000 10000 110 48 ASMT-MYK0 Warm White 2600 4000 110 40 Notes: 1. Optical Characteristics data are only applicable for ASMT-Mx00 component level device only. 2. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic [4] (TA = 25 C) Forward Voltage VF (Volts) @ IF = 350mA Reverse Voltage VR (Volts) Thermal Resistance Rj-b (C/W) [5] Dice Type Min Typ Max. Max. Typ. AlInGaP 2.0 2.4 3.0 5 12 InGaN 3.2 3.6 4.0 5 18 Note: 4. Electrical Characteristic data are only applicable for ASMT-Mx00 component level device only. 5. Rj-b is Thermal Resistance from LED junction to MCPCB. RED AMBER 430 480 530 580 630 WAVELENGTH - nm 680 730 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 780 Figure 1. Relative Intensity vs. Wavelength for AlInGaP RELATIVE LUMINOUS FLUX (v) - lm 1.2 RELATIVE INTENSITY 1.0 0.8 0.6 0.4 0.2 0 50 0.50 100 150 200 250 300 350 400 450 500 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -70 -50 MONO PULSE CURRENT - mA Figure 3. Relative Luminous Flux vs. Mono Pulse Current for AlInGaP RELATIVE LOP (NORMALIZED AT 25C) IF MAX FORWARD CURRENT - mA 3.00 -30 -10 10 30 OFF-AXIS ANGLE() 50 70 90 2 350 RJA = 50C/W 300 RJA = 40C/W 250 RJA = 30C/W 200 150 100 50 0 10 20 30 40 50 60 TA AMBIENT TEMPERATURE - C 70 80 90 Figure 5. Maximum forward current vs. ambient temperature for AlInGaP Derated based on TJMAX = 120C, RJA = 30C/W / 40C/W and 50C/W 2.50 Figure 4. Radiation Pattern for AlInGaP 400 0 1.00 1.50 2.00 FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage for AlInGaP 1.4 0.0 500 450 400 350 300 250 200 150 100 50 0 0.00 RED AMBER 1.5 1 0.5 0 -40 -25 -10 5 20 35 50 65 JUNCTION TEMPERATURE - C 80 95 Figure 6. Relative LOP (Normalized at 25C) vs. junction temperature for AlInGaP 110 GREEN BLUE COOL WHITE WARM WHITE 430 480 530 580 630 WAVELENGTH - nm 680 730 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 780 Figure 7. Relative Intensity vs. Wavelength for InGaN 1.00 RELATIVE INTENSITY RELATIVE LUMINOUS FLUX (v) - lm 1.20 0.80 0.60 0.40 0.20 0 50 100 150 200 250 300 350 400 450 500 MONO PULSE CURRENT - mA 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 400 540 350 530 520 300 RJA = 50C/W 250 RJA = 40C/W 200 RJA = 30C/W 150 100 50 0 0 10 20 30 40 50 60 70 TA AMBIENT TEMPERATURE - C 0.50 1.00 1.50 2.00 2.50 FORWARD VOLTAGE - V 3.00 3.50 4.00 70 90 80 GREEN BLUE COOL WHITE WARM WHITE -90 -70 -50 -30 -10 10 30 OFF-AXIS ANGLE () 50 Figure 10. Radiation Pattern for InGaN DOMINANT WAVELENGTH - nm IF MAX FORWARD CURRENT - mA Figure 9. Relative Luminous Flux vs. Mono Pulse Current for InGaN 90 Figure 11. Maximum forward current vs. ambient temperature for InGaN Derated based on TJMAX = 110C, RJA = 30C/W / 40C/W and 50C/W 0.00 Figure 8. Forward Current vs Forward Voltage for InGaN 1.40 0.00 500 450 400 350 300 250 200 150 100 50 0 Green 510 500 490 480 Blue 470 460 450 100 150 200 250 300 FORWARD CURRENT - mA 350 Figure 12. Dominant wavelength vs. forward current - InGaN devices 400 100mA 0.014 150mA Y-COORDINATES 0.012 0.010 250mA 0.008 0.006 0.004 0.002 300mA 350mA 0.000 0.000 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 X-COORDINATES Figure 13. Chromaticity Shift vs. Current RELATIVE FORWARD VOLTAGE SHIFT (mV) 0.016 300 250 200 150 100 50 0 -50 -100 -150 -200 -250 -300 -40 RELATIVE LOP (%) Normalized at 25C 2 GREEN BLUE COOL WHITE WARM WHITE 1 0.5 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 JUNCTION TEMPERATURE - C Figure 15. Relative LOP vs. junction temperature for InGaN Note: All parametric charts are only applicable for ASMT-Mx00 component level device only 10 35 TEMPERATURE - C Figure 14. Temperature vs. relative forward voltage shift *Note: (x,y) values @ 350mA reference to (0.0) 1.5 -15 60 85 Flux Bin Limit[1] (For reference only) [x1 x2] Bin Flux (lm) at 350mA Min Max A 5.5 7.0 B 7.0 9.0 C 9.0 11.5 D 11.5 15.0 E 15.0 19.5 F 19.5 25.5 G 25.5 33.0 H 33.0 43.0 J 43.0 56.0 K 56.0 73.0 Tolerence for each bin limits is 10 % Note: 1. Flux Bin Limit is only applicable for ASMT-Mx00 component level device only Color Bin Limits Amber Min. (nm) Max. (nm) A B C D E 582.0 584.5 587.0 589.5 592.0 584.5 587.0 589.5 592.0 594.5 Blue Min. (nm) Max. (nm) A B C D 460.0 465.0 470.0 475.0 465.0 470.0 475.0 480.0 Green Min. (nm) Max. (nm) A B C D 515.0 520.0 525.0 530.0 520.0 525.0 530.0 535.0 Color Bin Selections [x3] Individual reel will contain parts from one full bin only. Cool White 0 A B C D E F G H Z Y W V U T S Q P N M L K J 1 2 3 4 5 6 Warm White Full Distribution A only B only C only D only E only F only G only H only A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B and C only B, C and D only C, D and E only D, E and F only E, F and G only F, G and H only Special Color Bin A, B, C and D only E, F, G and H only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only 0 A B C D E F Z Y W V U Q P N M J 1 2 3 4 5 6 Full Distribution A only B only C only D only E only F only A and B only B and C only C and D only D and E only E and F only A, B and C only B, C and D only C, D and E only D, E and F only Special Color Bin A, B, C and D only E, F, G and H only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only Primary Color Binning Color Limits[1] (Chromaticity Coordinates) Cool White Color Limits[1] (Chromaticity Coordinates) Warm White Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 Tolerances 0.01 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k C 0.34 B H 5.6k Black Body Curve 0.32 7k D E 0.30 10kF 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE 0.48 0.46 0.44 Y - COORDINATE Y - COORDINATE Tolerance 0.01 A 0.42 0.40 0.38 0.36 E 4.0k F 3.5k D 3.0k B 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Note: 1. Color Limit and Color binning chart are only applicable for ASMT-Mx00 component level device only C Sub-Color Binning (Only Applicable for Color Bin A to Bin D and Bin G to Bin H) Color Limits[1] Bin A1 Warm White (Chromaticity Coordinates) X 0.364 0.367 0.348 0.347 Y 0.383 0.400 0.385 0.372 X 0.364 0.362 0.346 0.347 Y 0.383 0.372 0.359 0.372 X 0.329 0.329 0.348 0.347 Y 0.357 0.369 0.385 0.372 X 0.329 0.329 0.347 0.346 Y 0.345 0.357 0.372 0.359 X 0.362 0.360 0.344 0.346 Y 0.372 0.357 0.344 0.359 X 0.360 0.358 0.343 0.344 Y 0.357 0.343 0.331 0.344 Bin B3 X 0.358 0.356 0.341 0.343 Y 0.343 0.330 0.314 0.331 Bin B4 X 0.329 0.329 0.346 0.344 Y 0.331 0.345 0.359 0.344 X 0.329 0.344 0.343 0.329 Y 0.331 0.344 0.331 0.320 X 0.343 0.341 0.329 0.329 Y 0.331 0.314 0.302 0.320 X 0.329 0.329 0.315 0.314 Y 0.369 0.357 0.344 0.355 X 0.329 0.329 0.316 0.315 Y 0.357 0.345 0.333 0.344 X 0.314 0.315 0.303 0.301 Y 0.355 0.344 0.333 0.342 X 0.315 0.316 0.305 0.303 Y 0.344 0.333 0.322 0.333 Bin A2 Bin A3 Bin A4 Bin B1 Bin B2 Bin B5 Bin B6 Bin C1 Bin C2 Bin C3 Bin C4 (Chromaticity Coordinates) Bin D1 X Y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.33 Bin D2 X Y 0.329 0.331 0.329 0.320 0.318 0.310 0.317 0.320 Bin D3 X Y 0.329 0.320 0.329 0.302 0.320 0.293 0.318 0.310 Bin D4 X Y 0.316 0.333 0.317 0.320 0.307 0.311 0.305 0.322 Bin D5 X Y 0.317 0.320 0.318 0.310 0.309 0.300 0.307 0.311 Bin D6 X Y 0.318 0.310 0.320 0.293 0.311 0.285 0.309 0.300 Bin G1 X Y 0.392 0.421 0.386 0.400 0.364 0.383 0.367 0.400 Bin G2 X Y 0.386 0.400 0.382 0.385 0.362 0.372 0.364 0.383 Bin H1 X Y 0.382 0.385 0.378 0.370 0.360 0.357 0.362 0.372 Bin H2 X Y 0.378 0.370 0.375 0.358 0.358 0.34 0.360 0.357 Bin H3 X Y 0.375 0.358 0.371 0.344 0.356 0.330 0.358 0.343 Tolerance 0.01 Y - COORDINATE Cool White 0.44 0.42 0.40 G1 G2 A1 0.38 H1 4.0k A3 A2 H2 0.36 B1 A4 C1 4.5k B4 H3 C3 C2 B2 0.34 C4 D1 5.6k B3 Black Body Curve D4 D2 B5 0.32 B6 D5 D3 7k 0.30 D6 0.28 10k 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE Note: 1. Color Limit and Color binning chart are only applicable for ASMTMx00 component level device only 10 6.25 Package Tray Dimensions Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body (white plastic). DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2009 Avago Technologies. All rights reserved. AV02-1086EN - April 1, 2009