NBSG16 2.5V/3.3V SiGe Differential Receiver/Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG16 is a differential receiver/driver targeted for high frequency applications. The device is functionally equivalent to the EP16 and LVEP16 devices with much higher bandwidth and lower EMI capabilities. Inputs incorporate internal 50 W termination resistors and accept NECL (Negative ECL), PECL (Positive ECL), HSTL, LVTTL, LVCMOS, CML, or LVDS. Outputs are RSECL (Reduced Swing ECL), 400 mV. The VBB and VMM pins are internally generated voltage supplies available to this device only. The VBB is used as a reference voltage for single-ended NECL or PECL inputs and the VMM pin is used as a reference voltage for LVCMOS inputs. For all single-ended input conditions, the unused complementary differential input is connected to VBB or VMM as a switching reference voltage. VBB or VMM may also rebias AC coupled inputs. When used, decouple VBB and VMM via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB and VMM outputs should be left open. Features * * * * * * * * * * * Maximum Input Clock Frequency > 12 GHz Typical Maximum Input Data Rate > 12 Gb/s Typical 120 ps Typical Propagation Delay 40 ps Typical Rise and Fall Times RSPECL Output with Operating Range: VCC = 2.375 V to 3.465 V with VEE = 0 V RSNECL Output with RSNECL or NECL Inputs with Operating Range: VCC = 0 V with VEE = -2.375 V to -3.465 V RSECL Output Level (400 mV Peak-to-Peak Output), Differential Output Only 50 W Internal Input Termination Resistors Compatible with Existing 2.5 V/3.3 V LVEP, EP, and LVEL Devices VBB and VMM Reference Voltage Output Pb-Free Packages are Available (c) Semiconductor Components Industries, LLC, 2008 September, 2008 - Rev. 18 1 MARKING DIAGRAMS* SG 16 ALYWG G FCBGA-16 BA SUFFIX CASE 489 CC CC 16 1 QFN-16 MN SUFFIX CASE 485G A L Y W G SG 16 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Publication Order Number: NBSG16/D NBSG16 1 2 3 VEE VBB 4 16 A VEE D B NC NC VTD 15 VMM VEE 14 Exposed Pad (EP) 13 VEE VCC Q VTD 1 D 2 12 VCC 11 Q NBSG16 C D VTD VCC Q D VEE VBB VMM VEE Figure 1. BGA-16 Pinout (Top View) D 3 10 Q VTD 4 9 VCC 5 6 7 8 VEE NC NC VEE Figure 2. QFN-16 Pinout (Top View) Table 1. PIN DESCRIPTION Pin BGA QFN Name I/O C2 1 VTD - C1 2 D ECL, CML, LVCMOS, LVDS, LVTTL Input Inverted Differential Input. Internal 75 kW to VEE and 36.5 kW to VCC. B1 3 D ECL, CML, LVCMOS, LVDS, LVTTL Input Noninverted differential input. Internal 75 kW to VEE B2 4 VTD - Internal 50 W Termination Pin. See Table 2. A1,D1,A4, D4 5,8,13,16 VEE - Negative Supply Voltage A2,A3 6,7 NC - No Connect B3,C3 9,12 VCC - Positive Supply Voltage B4 10 Q RSECL Output Noninverted Differential Output. Typically Terminated with 50 W to VTT = VCC - 2 V C4 11 Q RSECL Output Inverted Differential Output. Typically Terminated with 50 W to VTT = VCC - 2 V D3 14 VMM - LVCMOS Reference Voltage Output. (VCC - VEE)/2 D2 15 VBB - ECL Reference Voltage Output N/A - EP - The Exposed Pad (EP) and the QFN-16 package bottom is thermally connected to the die for improved heat transfer out of package. The exposed pad must be attached to a heat-sinking conduit. The pad is not electrically connected to the die but may be electrically and thermally connected to VEE on the PC board. Description Internal 50 W Termination Pin. See Table 2. 1. The NC pins are electrically connected to the die and MUST be left open. 2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package bottom (see case drawing) must be attached to a heat-sinking conduit. 3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal is applied then the device will be susceptible to self-oscillation. http://onsemi.com 2 NBSG16 VCC VTD VMM 36.5 KW 50 W D Q D Q 75 kW 50 W 75 kW VTD VBB VEE Figure 3. Logic Diagram Table 2. INTERFACING OPTIONS INTERFACING OPTIONS CONNECTIONS CML Connect VTD and VTD to VCC LVDS Connect VTD and VTD together AC-COUPLED Bias VTD and VTD Inputs within (VIHCMR) Common Mode Range RSECL, PECL, NECL Standard ECL Termination Techniques LVTTL The external voltage should be applied to the unused complementary differential input. Nominal voltage is 1.5 V for LVTTL. LVCMOS VMM should be connected to the unused complementary differential input. Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor (D, D) 75 kW Internal Input Pullup Resistor (D) ESD Protection 36.5 kW Human Body Model Machine Model Moisture Sensitivity (Note 1) FCBGA-16 QFN-16 Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 2 kV > 100 V Pb Pkg Pb-Free Pkg Level 3 Level 1 Level 3 Level 1 UL 94 V-0 @ 0.125 in 167 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. http://onsemi.com 3 NBSG16 Table 4. MAXIMUM RATINGS Rating Unit VCC Symbol Positive Power Supply Parameter VEE = 0 V Condition 1 3.6 V VEE Negative Power Supply VCC = 0 V -3.6 V VI Positive Input Negative Input VEE = 0 V VCC = 0 V 3.6 -3.6 V V VINPP Differential Input Voltage 2.8 |VCC - VEE| V V Iout Output Current 25 50 mA mA IBB VBB Sink/Source 1 mA IMM VMM Sink/Source 1 mA TA Operating Temperature Range -40 to +85 C Tstg Storage Temperature Range -65 to +150 C qJA Thermal Resistance (Junction-to-Ambient) (Note 2) 0 lfpm 500 lfpm 0 lfpm 500 lfpm FCBGA-16 FCBGA-16 QFN-16 QFN-16 108 86 41.6 35.2 C/W C/W C/W C/W qJC Thermal Resistance (Junction-to-Case) 1S2P (Note 2) 2S2P (Note 3) FCBGA-16 QFN-16 5 4.0 C/W C/W Tsol Wave Solder 225 265 C |D - D| VCC - VEE w VCC - VEE < Condition 2 VI VCC VI VEE 2.8 V 2.8 V Continuous Surge Pb Pb-Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. JEDEC standard multilayer board - 1S2P (1 signal, 2 power) 3. JEDEC standard multilayer board - 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad. http://onsemi.com 4 NBSG16 Table 5. DC CHARACTERISTICS, INPUT WITH RSPECL OUTPUT VCC = 2.5 V; VEE = 0 V (Note 4) -40C 25C 85C Min Typ Max Min Typ Max Min Typ Max Unit 17 23 29 17 23 29 17 23 29 mA Output HIGH Voltage (Note 5) 1450 1530 1575 1525 1565 1600 1550 1590 1625 mV VOUTPP Output Voltage Amplitude 350 410 525 350 410 525 350 410 525 mV VIH Input HIGH Voltage (Single-Ended) (Note 6) VTHR + 75 mV VCC - 1.0* VCC VTHR + 75 mV VCC - 1.0* VCC VTHR + 75 mV VCC - 1.0* VCC V VIL Input LOW Voltage (Single-Ended) (Note 6) VEE VCC - 1.4* VTHR - 75 mV VEE VCC - 1.4* VTHR - 75 mV VEE VCC - 1.4* VTHR - 75 mV V VBB PECL Output Voltage Reference 1080 1140 1200 1080 1140 1200 1080 1140 1200 mV VIHCMR Input HIGH Voltage Common Mode Range (Note 7) (Differential Configuration) 2.5 1.2 2.5 1.2 2.5 V VMM CMOS Output Voltage Reference VCC/2 1100 1250 1400 1100 1250 1400 1100 1250 1400 mV RTIN Internal Input Termination Resistor 45 50 55 45 50 55 45 50 55 W IIH Input HIGH Current (@ VIH) 30 100 30 100 30 100 mA IIL Input LOW Current (@ VIL) 25 50 25 50 25 50 mA Symbol Characteristic IEE Negative Power Supply Current VOH 1.2 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. *Typicals used for testing purposes. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to -0.965 V. 5. All loading with 50 W to VCC - 2.0 V. 6. VTHR is the voltage applied to the complementary input, typically VBB or VMM. 7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 5 NBSG16 Table 6. DC CHARACTERISTICS, INPUT WITH RSPECL OUTPUT VCC = 3.3 V; VEE = 0 V (Note 8) -40C 25C 85C Min Typ Max Min Typ Max Min Typ Max Unit 17 23 29 17 23 29 17 23 29 mA Output HIGH Voltage (Note 9) 2250 2330 2375 2325 2365 2400 2350 2390 2425 mV VOUTPP Output Voltage Amplitude 350 410 525 350 410 525 350 410 525 mV VIH Input HIGH Voltage (Single-Ended) (Note 10) VTHR + 75 mV VCC - 1.0* VCC VTHR + 75 mV VCC - 1.0* VCC VTHR + 75 mV VCC - 1.0* VCC V VIL Input LOW Voltage (Single-Ended) (Note 10) VEE VCC - 1.4* VTHR - 75 mV VEE VCC - 1.4* VTHR - 75 mV VEE VCC - 1.4* VTHR - 75 mV V VBB PECL Output Voltage Reference 1880 1940 2000 1880 1940 2000 1880 1940 2000 mV VIHCMR Input HIGH Voltage Common Mode Range (Note 11) (Differential Configuration) 3.3 1.2 3.3 1.2 3.3 V VMM CMOS Output Voltage Reference VCC/2 1500 1650 1800 1500 1650 1800 1500 1650 1800 mV RTIN Internal Input Termination Resistor 45 50 55 45 50 55 45 50 55 W IIH Input HIGH Current (@ VIH) 30 100 30 100 30 100 mA IIL Input LOW Current (@ VIL) 25 50 25 50 25 50 mA Symbol Characteristic IEE Negative Power Supply Current VOH 1.2 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. *Typicals used for testing purposes. 8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to -0.165 V. 9. All loading with 50 W to VCC - 2.0 V. 10. VTHR is the voltage applied to the complementary input, typically VBB or VMM. 11. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 6 NBSG16 Table 7. DC CHARACTERISTICS, NECL OR RSNECL INPUT WITH NECL OUTPUT VCC = 0 V; VEE = -3.465 V to -2.375 V (Note 12) -40C Symbol Characteristic 25C 85C Min Typ Max Min Typ Max Min Typ Max Unit IEE Negative Power Supply Current 17 23 29 17 23 29 17 23 29 mA VOH Output HIGH Voltage (Note 13) -1050 -970 -925 -975 -935 -900 -950 -910 -875 mV VOUTPP Output Voltage Amplitude 350 410 525 350 410 525 350 410 525 mV VIH Input HIGH Voltage (Single-Ended) (Note 14) VTHR + 75 mV VCC - 1.0* VCC VTHR + 75 mV VCC - 1.0* VCC VTHR + 75 mV VCC - 1.0* VCC V VIL Input LOW Voltage (Single-Ended) (Note 14) VEE VCC - 1.4* VTHR - 75 mV VEE VCC - 1.4* VTHR - 75 mV VEE VCC - 1.4* VTHR - 75 mV V VBB NECL Output Voltage Reference -1420 -1360 -1300 -1420 -1360 -1300 -1420 -1360 -1300 mV VIHCMR Input HIGH Voltage Common Mode Range (Note 15) (Differential Configuration) 0.0 V VMM CMOS Output Voltage Reference (Note 16) VMMT -150 VMMT VMMT + 150 VMMT -150 VMMT VMMT + 150 VMMT -150 VMMT VMMT + 150 mV RTIN Internal Input Termination Resistor 45 50 55 45 50 55 45 50 55 W IIH Input HIGH Current (@ VIH) 30 100 30 100 30 100 mA IIL Input LOW Current (@ VIL) 25 50 25 50 25 50 mA VEE+1.2 0.0 VEE+1.2 0.0 VEE+1.2 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. *Typicals used for testing purposes. 12. Input and output parameters vary 1:1 with VCC. 13. All loading with 50 W to VCC - 2.0 V. 14. VTHR is the voltage applied to the complementary input, typically VBB or VMM. 15. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. 16. VMM typical = |VCC - VEE|/2 + VEE = VMMT http://onsemi.com 7 NBSG16 Table 8. AC CHARACTERISTICS for FCLGA-16 VCC = 0 V; VEE = -3.465 V to -2.375 V or VCC = 2.375 V to 3.465 V; VEE = 0 V -40C Symbol Characteristic fmax Maximum Frequency (See Figure 4. fmax/JITTER) (Note 17) tPLH, tPHL Propagation Delay to Output Differential tSKEW Duty Cycle Skew (Note 18) tJITTER RMS Random Clock Jitter Min Typ 10.7 12 90 110 130 3 0.2 fin < 10 GHz Peak-to-Peak Data Dependent Jitter fin < 10 Gb/s VINPP Input Voltage Swing/Sensitivity (Differential Configuration) (Note 19) tr tf Output Rise/Fall Times @ 1 GHz (20% - 80%) Max 30 45 85C Min Typ 10.7 12 100 120 140 15 3 1 0.2 TBD 75 Q, Q 25C Max Min Typ 10.7 12 105 125 145 ps 15 3 15 ps 1 0.2 1 TBD 2600 75 75 20 40 Max Unit GHz ps TBD 2600 75 65 20 40 2600 mV 65 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 17. Measured using a 400 mV source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V. Input edge rates 40 ps (20% - 80%). 18. See Figure 6. tskew = |tPLH - tPHL| for a nominal 50% differential clock input waveform. 19. VINPP(max) cannot exceed VCC - VEE Table 9. AC CHARACTERISTICS for QFN-16 VCC = 0 V; VEE = -3.465 V to -2.375 V or VCC = 2.375 V to 3.465 V; VEE = 0 V -40C Symbol Characteristic fmax Maximum Frequency (See Figure 4. fmax/JITTER) (Note 20) tPLH, tPHL Propagation Delay to Output Differential tSKEW Duty Cycle Skew (Note 21) tJITTER RMS Random Clock Jitter Min Typ 10.7 12 90 110 130 3 0.2 fin < 10 GHz Peak-to-Peak Data Dependent Jitter fin < 10 Gb/s VINPP Input Voltage Swing/Sensitivity (Differential Configuration) (Note 22) tr tf Output Rise/Fall Times @ 1 GHz (20% - 80%) Max 20 30 85C Min Typ 10.7 12 100 120 140 15 3 2 0.2 TBD 75 Q, Q 25C Max Min Typ 10.7 12 95 125 145 ps 15 3 15 ps 2 0.2 2 TBD 2600 75 50 20 30 Max Unit GHz ps TBD 2600 75 50 20 30 2600 mV 50 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 20. Measured using a 400 mV source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V. Input edge rates 40 ps (20% - 80%). 21. See Figure 6. tskew = |tPLH - tPHL| for a nominal 50% differential clock input waveform. 22. VINPP(max) cannot exceed VCC - VEE http://onsemi.com 8 NBSG16 9.5 600 8.5 7.5 500 6.5 OUTPUT AMP 5.5 400 4.5 Q Q 300 3.5 200 2.5 1.5 100 0 RMS JITTER 1 2 3 4 5 6 7 8 0.5 9 10 11 12 13 14 -0.5 INPUT FREQUENCY (GHz) Figure 4. Output Voltage Amplitude (VOUTPP) / RMS Jitter vs. Input Frequency (fin) at Ambient Temperature (Typical) X = 17ps/Div Y = 70 mV/Div Figure 5. 10.709 Gb/s Diagram (3.0 V, 255C) D VINPP = VIH(D) - VIL(D) D Q VOUTPP = VOH(Q) - VOL(Q) Q tPHL tPLH Figure 6. AC Reference Measurement http://onsemi.com 9 JITTEROUT ps (RMS) OUTPUT VOLTAGE AMPLITUDE (mV) 700 NBSG16 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC - 2.0 V Figure 7. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping NBSG16BAHTBG FCBGA-16 (Pb-Free) 100 / Tape & Reel NBSG16BA FCBGA-16 100 Units / Tray (Contact Sales Representative) NBSG16BAR2 FCBGA-16 100 / Tape & Reel (Contact Sales Representative) QFN-16 123 Units / Rail NBSG16MNG QFN-16 (Pb-Free) 123 Units / Rail NBSG16MNR2 QFN-16 3000 / Tape & Reel NBSG16MNR2G QFN-16 (Pb-Free) 3000 / Tape & Reel NBSG16MNHTBG QFN-16 (Pb-Free) 100 / Tape & Reel Device NBSG16MN Board Description NBSG16BAEVB NBSG16BA Evaluation Board For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NBSG16 PACKAGE DIMENSIONS FCBGA-16 BA SUFFIX PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O LASER MARK FOR PIN 1 IDENTIFICATION IN THIS AREA -X- D M -Y- K E M 0.20 3X e 4 3 2 FEDUCIAL FOR PIN A1 IDENTIFICATION IN THIS AREA 1 A B 3 C 16 X b D S VIEW M-M 0.15 M Z X Y 0.08 M Z 5 0.15 Z A A2 A1 16 X 4 -Z- 0.10 Z DETAIL K ROTATED 90 _ CLOCKWISE http://onsemi.com 11 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z (SEATING PLANE) IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM A A1 A2 b D E e S MILLIMETERS MIN MAX 1.40 MAX 0.25 0.35 1.20 REF 0.30 0.50 4.00 BSC 4.00 BSC 1.00 BSC 0.50 BSC NBSG16 PACKAGE DIMENSIONS 16 PIN QFN CASE 485G-01 ISSUE C PIN 1 LOCATION CC CC CC 0.15 C D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM MINIMUM SPACING BETWEEN LEAD TIP AND FLAG A B E DIM A A1 A3 b D D2 E E2 e K L TOP VIEW 0.15 C (A3) 0.10 C A 16 X SEATING PLANE 0.08 C SIDE VIEW A1 16X L 5 NOTE 5 e 4 16X 3.25 0.128 0.30 0.012 EXPOSED PAD 9 E2 K 12 1 16 16X 1.50 0.059 3.25 0.128 e 13 b 0.10 C A B 0.05 C 0.575 0.022 EXPOSED PAD 8 SOLDERING FOOTPRINT* C D2 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 1.65 1.85 3.00 BSC 1.65 1.85 0.50 BSC 0.18 TYP 0.30 0.50 BOTTOM VIEW 0.50 0.02 NOTE 3 0.30 0.012 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and solderin details, please download the ON Semiconductor Soldering an Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 http://onsemi.com 12 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NBSG16/D