[ /Title (CD54H C30, CD74H C30, CD74H CT30) /Subject (High Speed CMOS Logic 8- CD54/74HC30, CD54/74HCT30 Data sheet acquired from Harris Semiconductor SCHS121D High Speed CMOS Logic 8-Input NAND Gate August 1997 - Revised September 2003 Features Description * Buffered Inputs The 'HC30 and 'HCT30 each contain an 8-input NAND gate in one package. They provide the system designer with the direct implementation of the positive logic 8-input NAND function. Logic gates utilize silicon gate CMOS technology to achieve operating speeds similar to LSTTL gates with the low power consumption of standard CMOS integrated circuits. All devices have the ability to drive 10 LSTTL loads. The HCT logic family is functionally pin compatible with the standard LS logic family. * Typical Propagation Delay: 10ns at VCC = 5V, CL = 15pF, TA = 25oC * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times Ordering Information * Significant Power Reduction Compared to LSTTL Logic ICs PART NUMBER * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH Pinout CD54HC30, CD54HCT30 (CERDIP) CD74HC30 (PDIP, SOIC, SOP, TSSOP) CD74HCT30 (PDIP, SOIC) TOP VIEW A 1 14 VCC B 2 13 NC C 3 12 H D 4 11 G E 5 10 NC F 6 9 NC GND 7 8 Y TEMP. RANGE (oC) CD54HC30F3A -55 to 125 14 Ld CERDIP CD54HCT30F3A -55 to 125 14 Ld CERDIP CD74HC30E -55 to 125 14 Ld PDIP CD74HC30M -55 to 125 14 Ld SOIC CD74HC30MT -55 to 125 14 Ld SOIC CD74HC30M96 -55 to 125 14 Ld SOIC CD74HC30NSR -55 to 125 14 Ld SOP CD74HC30PW -55 to 125 14 Ld TSSOP CD74HC30PWR -55 to 125 14 Ld TSSOP CD74HC30PWT -55 to 125 14 Ld TSSOP CD74HCT30E -55 to 125 14 Ld PDIP CD74HCT30M -55 to 125 14 Ld SOIC CD74HCT30MT -55 to 125 14 Ld SOIC CD74HCT30M96 -55 to 125 14 Ld SOIC NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) 2003, Texas Instruments Incorporated. PACKAGE 1 CD54/74HC30, CD54/74HCT30 Functional Diagram 1 A 2 B 3 C 4 D 5 E 6 F 11 G 12 H 8 Y Y = ABCDEFGH TRUTH TABLE INPUTS A B C D E F G H OUTPUT L X X X X X X X H X L X X X X X X H X X L X X X X X H X X X L X X X X H X X X X L X X X H X X X X X L X X H X X X X X X L X H X X X X X X X L H H H H H H H H H L NOTE: H = HIGH Voltage Level, L = LOW Voltage Level, X = Irrelevant Logic Symbol 1 A B C D E 2 3 4 8 Y 5 6 F G H 11 12 2 CD54/74HC30, CD54/74HCT30 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .50mA Package Thermal Impedance, JA (see Note 1) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86oC/W NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76oC/W PW (TSSOP) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 113oC/W Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) High Level Input Voltage VIH - Low Level Input Voltage VIL 25oC IO (mA) VCC (V) -40oC TO +85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V HC TYPES High Level Output Voltage CMOS Loads VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - - -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V - 6 - - 0.1 - 1 - 1 A 3 CD54/74HC30, CD54/74HCT30 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) ICC VCC or GND 0 High Level Input Voltage VIH - Low Level Input Voltage VIL High Level Output Voltage CMOS Loads VOH PARAMETER Quiescent Device Current 25oC IO (mA) VCC (V) -40oC TO +85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 6 - - 2 - 20 - 40 A - 4.5 to 5.5 2 - - 2 - 2 - V - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 0.1 - 1 - 1 A HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC and GND - 5.5 - ICC VCC or GND 0 5.5 - - 2 - 20 - 40 A ICC VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 A Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 2) NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS All 0.6 NOTE: Unit Load is ICC limit specified in DC Electrical Specifications table, e.g. 360A max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 130 - 165 - 195 ns 4.5 - - 26 - 33 - 39 ns 6 - - 22 - 28 - 33 ns 5 - 10 - - - - - ns HC TYPES Propagation Delay, Input to Output (Figure 1) Propagation Delay, Data Input to Output Y tPLH, tPHL CL = 15pF 4 CD54/74HC30, CD54/74HCT30 Switching Specifications Input tr, tf = 6ns PARAMETER Transition Times (Figure 1) Input Capacitance Power Dissipation Capacitance (Notes 3, 4) (Continued) SYMBOL TEST CONDITIONS tTLH, tTHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns CI - - - - 10 - 10 - 10 pF CPD - 5 - 25 - - - - - pF HCT TYPES Propagation Delay, Input to Output (Figure 2) tRHL, tPHL CL = 50pF 4.5 - - 28 - 35 - 42 ns Propagation Delay, Data Input to Output Y tPLH, tPHL CL = 15pF 5 - 11 - - - - - ns Transition Times (Figure 2) tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns Input Capacitance Power Dissipation Capacitance (Notes 3, 4) CI - - - - 10 - 10 - 10 pF CPD - 5 - 26 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per gate. 4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns 90% 50% 10% INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-8974601CA ACTIVE CDIP J 14 1 TBD Call TI Call TI 8404001CA ACTIVE CDIP J 14 1 TBD Call TI Call TI CD54HC30F ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type CD54HC30F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type CD54HCT30F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type CD74HC30E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC30EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC30M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp CD74HC30PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC30PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT30EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT30M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT30MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF CD54HC30, CD54HCT30, CD74HC30, CD74HCT30 : * Catalog: CD74HC30, CD74HCT30 * Military: CD54HC30, CD54HCT30 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CD74HC30M96 SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 6.5 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.0 2.1 8.0 16.0 Q1 CD74HC30MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD74HC30NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD74HC30PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD74HC30PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 CD74HCT30M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD74HCT30MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC30M96 SOIC D 14 2500 367.0 367.0 38.0 CD74HC30MT SOIC D 14 250 367.0 367.0 38.0 CD74HC30NSR SO NS 14 2000 367.0 367.0 38.0 CD74HC30PWR TSSOP PW 14 2000 367.0 367.0 35.0 CD74HC30PWT TSSOP PW 14 250 367.0 367.0 35.0 CD74HCT30M96 SOIC D 14 2500 367.0 367.0 38.0 CD74HCT30MT SOIC D 14 250 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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