ESP32-WROVER Datasheet Version 2.2 Espressif Systems Copyright (c) 2019 www.espressif.com About This Document This document provides the specifications for the ESP32-WROVER modules with a PCB antenna or an IPEX antenna. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright (c) 2019 Espressif Inc. All rights reserved. Contents 1 Overview 1 2 Pin Definitions 3 2.1 Pin Layout 3 2.2 Pin Description 4 2.3 Strapping Pins 5 3 Functional Description 7 3.1 CPU and Internal Memory 7 3.2 External Flash and SRAM 7 3.3 Crystal Oscillators 7 3.4 RTC and Low-Power Management 8 4 Peripherals and Sensors 9 5 Electrical Characteristics 10 5.1 Absolute Maximum Ratings 10 5.2 Recommended Operating Conditions 10 5.3 DC Characteristics (3.3 V, 25 C) 10 5.4 Wi-Fi Radio 11 5.5 BLE Radio 12 5.6 5.5.1 Receiver 12 5.5.2 Transmitter 12 Reflow Profile 13 6 Schematics 14 7 Peripheral Schematics 15 8 Physical Dimensions 17 9 Recommended PCB Land Pattern 18 10U.FL Connector Dimensions 19 11Learning Resources 20 11.1 Must-Read Documents 20 11.2 Must-Have Resources 20 Revision History 21 List of Tables 1 ESP32-WROVER Ordering Information 1 2 ESP32-WROVER Specifications 1 3 Pin Definitions 4 4 Strapping Pins 5 5 Absolute Maximum Ratings 10 6 Recommended Operating Conditions 10 7 DC Characteristics (3.3 V, 25 C) 10 8 Wi-Fi Radio Characteristics 11 9 Receiver Characteristics - BLE 12 10 Transmitter Characteristics - BLE 12 List of Figures 1 Pin Layout of ESP32-WROVER (Top View) 3 2 Reflow Profile 13 3 Schematics of ESP32-WROVER 14 4 Peripheral Schematics of ESP32-WROVER 15 5 Discharge Circuit for VDD33 Rail 16 6 Reset Circuit 16 7 Physical Dimensions of ESP32-WROVER 17 8 Recommended PCB Land Pattern of ESP32-WROVER 18 9 U.FL Connector Dimensions 19 1. Overview 1. Overview ESP32-WROVER is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. This module is provided in two versions: one with a PCB antenna, the other with an IPEX antenna. ESP32WROVER features a 4 MB external SPI flash and an additional 8 MB SPI Pseudo static RAM (PSRAM). The ordering information on the two variants of ESP32-WROVER is listed as follows: Table 1: ESP32-WROVER Ordering Information Module ESP32-WROVER (PCB) ESP32-WROVER (IPEX) Chip embedded Flash PSRAM Dimensions (mm) ESP32-D0WDQ6 4 MB 8 MB (18.000.10)x(31.400.10)x(3.300.10) For detailed ordering information, please see Espressif Product Ordering Information. For dimensions of the IPEX connector, please see Chapter 10. The information in this datasheet is applicable to both modules. At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, IS and IC. Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 A, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products even after their release, at minimum cost and effort. Table 2 provides the specifications of ESP32-WROVER. Table 2: ESP32-WROVER Specifications Categories Items Specifications Certification RF certification FCC/CE-RED/SRRC/TELEC Wi-Fi certification Wi-Fi Alliance Espressif Systems 1 ESP32-WROVER Datasheet V2.2 1. Overview Categories Test Items Specifications Bluetooth certification BQB Green certification RoHS/REACH Reliablity HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n (802.11n up to 150 Mbps) Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 s guard interval support Frequency range 2.4 GHz ~ 2.5 GHz Protocols Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with -97 dBm sensitivity Bluetooth Radio Class-1, class-2 and class-3 transmitter AFH Audio CVSD and SBC SD card, UART, SPI, SDIO, I2 C, LED PWM, Motor PWM, Module interfaces I2 S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC Hardware On-chip sensor Hall sensor Integrated crystal 40 MHz crystal Integrated SPI flash 4 MB Integrated PSRAM 8 MB Operating voltage/Power supply 2.3 V ~ 3.6 V Operating current Average: 80 mA Minimum current delivered by power supply Recommended operating temperature range Espressif Systems 500 mA -40 C ~ 85 C Package size (18.000.10) mm x (31.400.10) mm x (3.300.10) mm Moisture sensitivity level (MSL) Level 3 2 ESP32-WROVER Datasheet V2.2 2. Pin Definitions 2. Pin Definitions 2.1 Pin Layout Keepout Zone 1 GND GND 38 2 VDD33 IO23 37 3 EN IO22 36 4 SENSOR_VP TXD0 35 5 SENSOR_VN RXD0 34 6 IO34 IO21 33 7 IO35 NC 32 IO19 31 39 GND 8 IO32 9 IO33 IO18 30 10 IO25 IO5 29 11 IO26 NC 28 12 IO27 NC 27 13 IO14 IO4 26 14 IO12 IO0 25 15 GND IO2 24 16 IO13 IO15 23 17 SD2 SD1 22 18 SD3 SD0 21 19 CMD CLK 20 Figure 1: Pin Layout of ESP32-WROVER (Top View) Espressif Systems 3 ESP32-WROVER Datasheet V2.2 2. Pin Definitions 2.2 Pin Description ESP32-WROVER has 38 pins. See pin definitions in Table 3. Table 3: Pin Definitions Name No. Type Function GND 1 P Ground 3V3 2 P Power supply EN 3 I Module-enable signal. Active high. SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0 SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3 IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4 IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 8 I/O IO33 9 I/O IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 13 I/O IO12 1 14 I/O GND 15 P IO13 16 I/O SHD/SD2 2 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SWP/SD3 2 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD SCS/CMD 2 GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS SCK/CLK 2 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SDO/SD0 2 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS IO15 23 I/O IO2 24 I/O IO0 25 I/O IO4 26 I/O NC1 27 - - NC2 28 - - IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7 SDI/SD1 2 Espressif Systems GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER 4 ESP32-WROVER Datasheet V2.2 2. Pin Definitions Name No. Type Function IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground Notice: 1. GPIO12 is internally pulled high in the module and is not recommended for use as a touch pin. 2. Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the SPI flash integrated on the module and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: * MTDI * GPIO0 * GPIO2 * MTDO * GPIO5 Software can read the values of these five bits from register "GPIO_STRAPPING". During the chip's system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down. The strapping bits configure the device's boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 4 for a detailed boot-mode configuration by strapping pins. Table 4: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default Espressif Systems 3.3 V 1.8 V 5 ESP32-WROVER Datasheet V2.2 2. Pin Definitions MTDI Pull-down 0 1 Booting Mode Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don't-care 0 Enabling/Disabling Debugging Log Print over U0TXD During Booting Pin Default U0TXD Active U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave Falling-edge Sampling Falling-edge Sampling Rising-edge Sampling Rising-edge Sampling Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output Pull-up 0 0 1 1 Pull-up 0 1 0 1 Pin Default MTDO GPIO5 Note: * Firmware can configure register bits to change the settings of "Voltage of Internal LDO (VDD_SDIO)" and "Timing of SDIO Slave" after booting. * The MTDI is internally pulled high in the module, as the flash and SRAM in ESP32-WROVER only support a power voltage of 1.8 V (output by VDD_SDIO). Espressif Systems 6 ESP32-WROVER Datasheet V2.2 3. Functional Description 3. Functional Description This chapter describes the modules and functions integrated in ESP32-WROVER. 3.1 CPU and Internal Memory ESP32-D0WDQ6 contains two low-power Xtensa(R) 32-bit LX6 microprocessors. The internal memory includes: * 448 KB of ROM for booting and core functions. * 520 KB of on-chip SRAM for data and instructions. * 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. * 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. * 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. 3.2 External Flash and SRAM ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers' programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches. * The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. - When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. - When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. * External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported. ESP32-WROVER integrates a 4 MB of external SPI flash and an 8 MB PSRAM for more memory space. 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Espressif Systems 7 ESP32-WROVER Datasheet V2.2 3. Functional Description 3.4 RTC and Low-Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32's power consumption in different power modes, please refer to section "RTC and Low-Power Management" in ESP32 Datasheet. Espressif Systems 8 ESP32-WROVER Datasheet V2.2 4. Peripherals and Sensors 4. Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: 1. GPIO12 is internally pulled high in the module and is not recommended for use as a touch pin. 2. External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are connected to the module's integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module's integrated PSRAM. For details, please see Chapter 6 Schematics. Espressif Systems 9 ESP32-WROVER Datasheet V2.2 5. Electrical Characteristics 5. Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 5: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage -0.3 3.6 V Cumulative IO output current - 1,100 mA Storage temperature -40 150 C Ioutput 1 Tstore 1. The module worked properly after a 24-hour test in ambient temperature at 25 C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 2. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. 5.2 Recommended Operating Conditions Table 6: Recommended Operating Conditions Symbol Parameter Min Typical Max Unit VDD33 - 2.3 3.3 3.6 V IV DD Current delivered by external power supply 0.5 - - A T Operating temperature -40 - 85 C 5.3 DC Characteristics (3.3 V, 25 C) Table 7: DC Characteristics (3.3 V, 25 C) Symbol CIN VIH Parameter Min Pin capacitance - High-level input voltage 0.75xVDD 1 Typ Max 2 - - Unit pF 1 VDD +0.3 V 1 VIL Low-level input voltage -0.3 - 0.25xVDD IIH High-level input current - - 50 nA IIL Low-level input current - - 50 nA - - VOH VOL High-level output voltage 0.8xVDD Low-level output voltage High-level source current 1 IOH 1 (VDD = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum) Espressif Systems V V 1 - - 0.1xVDD V VDD3P3_CPU power domain 1, 2 - 40 - mA VDD3P3_RTC power domain 1, 2 - 40 - mA - 20 - mA VDD_SDIO power domain 1, 10 3 ESP32-WROVER Datasheet V2.2 5. Electrical Characteristics Symbol Parameter Min Typ Max Unit - 28 - mA Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, IOL output drive strength set to the maximum) RP U Resistance of internal pull-up resistor - 45 - k RP D Resistance of internal pull-down resistor - 45 - k VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V Notes: 1. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 5.4 Wi-Fi Radio Table 8: Wi-Fi Radio Characteristics Parameter Operating frequency range Output impedance TX power note2 note3 Sensitivity Adjacent channel rejection note1 Condition Min Typical Max Unit - 2412 - 2484 MHz - - See note 2 - 11n, MCS7 12 13 14 dBm 11b mode 17.5 18.5 20 dBm 11b, 1 Mbps - -98 - dBm 11b, 11 Mbps - -89 - dBm 11g, 6 Mbps - -92 - dBm 11g, 54 Mbps - -74 - dBm 11n, HT20, MCS0 - -91 - dBm 11n, HT20, MCS7 - -71 - dBm 11n, HT40, MCS0 - -89 - dBm 11n, HT40, MCS7 - -69 - dBm 11g, 6 Mbps - 31 - dB 11g, 54 Mbps - 14 - dB 11n, HT20, MCS0 - 31 - dB 11n, HT20, MCS7 - 13 - dB 1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency range is configurable by software. 2. For the modules that use IPEX antennas, the output impedance is 50 . For other modules without IPEX antennas, users do not need to concern about the output impedance. 3. Target TX power is configurable based on device or certification requirements. Espressif Systems 11 ESP32-WROVER Datasheet V2.2 5. Electrical Characteristics 5.5 BLE Radio 5.5.1 Receiver Table 9: Receiver Characteristics - BLE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER - - -97 - dBm Maximum received signal @30.8% PER - 0 - - dBm Co-channel C/I - - +10 - dB F = F0 + 1 MHz - -5 - dB F = F0 - 1 MHz - -5 - dB F = F0 + 2 MHz - -25 - dB F = F0 - 2 MHz - -35 - dB F = F0 + 3 MHz - -25 - dB F = F0 - 3 MHz - -45 - dB 30 MHz ~ 2000 MHz -10 - - dBm 2000 MHz ~ 2400 MHz -27 - - dBm 2500 MHz ~ 3000 MHz -27 - - dBm 3000 MHz ~ 12.5 GHz -10 - - dBm - -36 - - dBm Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation 5.5.2 Transmitter Table 10: Transmitter Characteristics - BLE Parameter Conditions Min Typ Max Unit RF transmit power - - 0 - dBm Gain control step - - 3 - dBm RF power control range - -12 - +9 dBm F = F0 2 MHz - -52 - dBm F = F0 3 MHz - -58 - dBm F = F0 > 3 MHz - -60 - dBm f 1avg - - - 265 kHz f 2max - 247 - - kHz f 2avg / f 1avg - - -0.92 - - ICFT - - -10 - kHz Drift rate - - 0.7 - kHz/50 s Drift - - 2 - kHz Adjacent channel transmit power Espressif Systems 12 ESP32-WROVER Datasheet V2.2 5. Electrical Characteristics Temperature () 5.6 Reflow Profile Peak Temp. 235 ~ 250 250 Preheating zone 150 ~ 200 60 ~ 120s 217 200 Reflow zone !217 60 ~ 90s Cooling zone -1 ~ -5/s Soldering time > 30s Ramp-up zone 1 ~ 3/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone -- Temp.: <150 Time: 60 ~ 90s Ramp-up rate: 1 ~ 3/s Preheating zone -- Temp.: 150 ~ 200 Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8/s Reflow zone -- Temp.: >217 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250 (<245 recommended) Time: 30 ~ 70s Cooling zone -- Peak Temp. ~ 180 Ramp-down rate: -1 ~ -5/s Solder -- Sn&Ag&Cu Lead-free solder (SAC305) Figure 2: Reflow Profile Espressif Systems 13 ESP32-WROVER Datasheet V2.2 5 4 3 2 1 6. Schematics D D ESP32 Module: with 1.8V Flash & SRAM Pin.1 GND Pin.15 GND Pin.38 GND GND The BLUE netname means 1.8V. GND XIN C1 22pF/6.3V(10%) 3 GND The values of C1 and C2 vary with the selection of a crystal. GND XOUT U1 GND GND 4 Espressif Systems 6. Schematics Pin.16 IO13 VDD33 GND Pin.37 IO23 GPIO13 GND GPIO23 C2 22pF/6.3V(10%) Pin.3 CHIP_PU/EN 2 VDD33 1 D1 ESD3.3V88D-LCDN Pin.2 VDD33 Pin.17 SD2 CHIP_PU Pin.36 IO22 SHD/SD2 GPIO22 C3 GND 100pF/6.3V(10%) R1 VDD33 GND C6 C9 10nF/6.3V(10%) GND 40MHz+/-10ppm 20K(5%) GPIO21 U0TXD U0RXD GPIO22 GPIO19 C5 3.3nF/6.3V(10%) 0.1uF/6.3V(10%) GND J39 GND GND ANT1 1 2 C11 C10 R15 GND 0R(5%) GND C14 C15 PCB ANT TBD GND TBD L4 TBD C16 270pF/6.3V(10%) C17 GND GND GND 270pF/6.3V(10%) 14 1 2 3 4 SENSOR_VP 5 6 7 SENSOR_VN8 CHIP_PU 9 10 GPIO34 11 GPIO35 12 GPIO32 VDD33 VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP U2 R12 0R(5%) Pin.35 TXD0 SWP/SD3 Pin.5 SENSOR_VN U0TXD Pin.19 CMD SENSOR_VN Pin.34 RXD0 SCS/CMD U0RXD C GND GPIO23 GPIO18 GPIO5 SD_DATA_1 SD_DATA_0 SD_CLK SD_CMD SD_DATA_3 SD_DATA_2 GPIO17 VDD_SDIO GPIO16 36 35 34 33 32 31 30 29 28 27 26 25 GPIO23 GPIO18 GPIO5 SDI/SD1 SDO/SD0 SCK/CLK SCS/CMD SWP/SD3 SHD/SD2 GPIO17 GPIO16 VDD_SDIO C18 Pin.6 IO34 Pin.20 CLK FLASH_CLK GPIO34 Pin.7 IO35 GPIO21 Pin.21 SD0 GPIO35 Pin.32 NC SDO/SD0 Pin.8 IO32 Pin.22 SD1 GPIO32 C24 Pin.33 IO21 Pin.31 IO19 SDI/SD1 GPIO19 4.7uF/16V(10%) 2K(5%) ESP32-D0WDQ6 GND SCK/CLK Pin.18 SD3 SENSOR_VP 0.1uF/6.3V(10%) 32K_XN GPIO25 GPIO26 GPIO27 MTMS MTDI VDD3P3_RTC MTCK MTDO GPIO2 GPIO0 GPIO4 The values of C14, L4 and C15 vary with the actual selection of a PCB board. C4 48 47 46 45 44 43 42 41 40 39 38 37 GND C12 10uF/6.3V(10%) 10uF/6.3V(10%) 1uF/10V(20%) 0.1uF/6.3V(10%) 13 14 15 16 17 18 19 20 21 22 23 24 3 2 C13 R14 0R(5%)/NC 1 49 GND IPEX C CAP1 CAP2 VDDA XTAL_P XTAL_N VDDA GPIO21 U0TXD U0RXD GPIO22 GPIO19 VDD3P3_CPU VDD33 Pin.4 SENSOR_VP GND VDD33 Pin.9 IO33 FLASH_CLK Pin.23 IO15 GPIO33 Pin.30 IO18 GPIO15 GPIO18 0R(5%)(NC) GPIO17 R13 0R(5%) GPIO13 GPIO15 GPIO2 GPIO0 GPIO4 GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 C19 R11 0.1uF/6.3V(10%) Pin.10 IO25 GND SRAM_CLK Pin.24 IO2 GPIO25 B Pin.29 IO5 GPIO2 GPIO5 Pin.11 IO26 B Pin.28 NC GPIO26 VDD_SDIO VDD_SDIO Pin.12 IO27 8 R10 SHD/SD2 7 /CS CLK /HOLD FLASH GND 1 FLASH_CLK 6 VCC U3 SCS/CMD Pin.27 NC GPIO27 10K(5%) DI DO /WP 5 SDI/SD1 2 SDO/SD0 3 SWP/SD3 U4 1 2 3 4 GPIO16 SDO/SD0 SWP/SD3 CS# VDD SO/SIO1 SIO3 SIO2 SCLK VSS SI/SIO0 8 7 6 5 SHD/SD2 SRAM_CLK SDI/SD1 Pin.13 IO14 Pin.26 IO4 VDD33 GPIO14 GPIO4 PSRAM 4 ESP32-WROVER Datasheet V2.2 VDD_SDIO R9 GND Pin.14 IO12 GND 10K(5%) GPIO12 Pin.39 GND Pin.25 IO0 GND GPIO0 Figure 3: Schematics of ESP32-WROVER A A Title ESP32-WROVER-V4 Size C Date: 5 4 3 2 Document Number Rev <Doc> Wednesday, November 14, 2018 Sheet 1 of 1 1 Espressif Systems 7. Peripheral Schematics 7. Peripheral Schematics U1 R1 C1 C2 TBD 0.1uF/50V(10%) 22uF/25V(10%) GND C3 TBD GND EN GPI36 SENSOR_VP GPI39 SENSOR_VN GPI34 GPI35 GPIO32 GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 GND GPIO13 SD2 SD3 CMD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 GND1 3V3 EN SENSOR_VP SENSOR_VN IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 GND2 IO13 SD2 SD3 CMD P_GND GND3 IO23 IO22 TXD0 RXD0 IO21 NC IO19 IO18 IO5 NC2 NC1 IO4 IO0 IO2 IO15 SD1 SD0 CLK VDD33 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 GND GPIO23 GPIO22 TXD0 RXD0 GPIO21 JP1 1 2 3 4 GPIO19 GPIO18 GPIO5 1 2 3 4 UART GND GPIO4 GPIO0 GPIO2 GPIO15 SDI SDO SCK 1 2 GND GND 1 2 VDD33 JP2 Boot Option SW1 R2 C4 0R(5%) JP3 EN 1 2 3 4 0.1uF/50V(10%) 1 2 3 4 GPIO14 GPIO12 GPIO13 GPIO15 MTMS MTDI MTCK MTDO JTAG GND Figure 4: Peripheral Schematics of ESP32-WROVER Note: * Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. * To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 k and C = 0.1 F. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32's power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet. Espressif Systems 15 ESP32-WROVER Datasheet V2.2 7. Peripheral Schematics Discharge Circuit VCC 1 2 SW1 CAP Added By User D1 VDD33 Q1 5 + C1 Bulk CAP 4 ESP Module 3 R2 R1 100K 1K GND GND GND GND Figure 5: Discharge Circuit for VDD33 Rail Note: The discharge circuit can be applied in scenarios where ESP32 is powered on and off repeatedly by switching the power rails, and there is a large capacitor on the VDD33 rail. For details, please refer to Section Power Scheme in ESP32 Datasheet. U1 GND VBAT R1 0R 3 1 GND 2 CHIP_PU VCC RESET# Power Supply Supervisor R2 100K GND Figure 6: Reset Circuit Note: When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recommended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the power supply for ESP32 is below 2.3 V. Espressif Systems 16 ESP32-WROVER Datasheet V2.2 8. Physical Dimensions Espressif Systems 8. Physical Dimensions ESP32-WROVER PCB/IPEX DIMENSIONS 3.300.10 Unit: mm Module Thickness Module Width 18.000.10 6.000.10 18.000.10 0.900.10 PCB Thickness Antenna Area 0.450.10 2.150.10 10.450.10 22.860.10 23.050.10 4.000.10 5.600.10 14.150.10 24.100.10 20.350.10 4.000.10 31.400.10 17 Module Length 0.800.10 1.270.10 0.90.10 15.850.10 1.270.10 1.100.10 ESP32-WROVER Datasheet V2.2 0.850.10 Top View Side View Figure 7: Physical Dimensions of ESP32-WROVER Bottom View 9. Recommended PCB Land Pattern 9. Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 6.30 18.00 1 38 31.40 5.00 0.90 5.00 1.33 Antenna Area 2.00 1.27 16.46 1.33 8.00 20 19 1.10 0.50 Figure 8: Recommended PCB Land Pattern of ESP32-WROVER Espressif Systems 18 ESP32-WROVER Datasheet V2.2 10. U.FL Connector Dimensions 10. U.FL Connector Dimensions Unit: mm Figure 9: U.FL Connector Dimensions Espressif Systems 19 ESP32-WROVER Datasheet V2.2 11. Learning Resources 11. Learning Resources 11.1 Must-Read Documents The following link provides documents related to ESP32. * ESP32 Datasheet This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. * ESP-IDF Programming Guide It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference. * ESP32 Technical Reference Manual The manual provides detailed information on how to use the ESP32 memory and peripherals. * ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. * ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development boards. * ESP32 AT Instruction Set and Examples This document introduces the ESP32 AT commands, explains how to use them, and provides examples of several common AT commands. * Espressif Products Ordering Information 11.2 Must-Have Resources Here are the ESP32-related must-have resources. * ESP32 BBS This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. * ESP32 GitHub ESP32 development projects are freely distributed under Espressif's MIT license on GitHub. It is established to help developers get started with ESP32 and foster innovation and the growth of general knowledge about the hardware and software surrounding ESP32 devices. * ESP32 Tools This is a webpage where users can download ESP32 Flash Download Tools and the zip file "ESP32 Certification and Test". * ESP-IDF This webpage links users to the official IoT development framework for ESP32. * ESP32 Resources This webpage provides the links to all available ESP32 documents, SDK and tools. Espressif Systems 20 ESP32-WROVER Datasheet V2.2 Revision History Revision History Date Version Release notes * Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-WROVER Specifications; * Added notes about "Operating frequency range" and "TX power" under Table 2019.09 V2.2 8 Wi-Fi Radio Characteristics; * Updated Section 7 Peripheral Schematics and added a note about RC delay circuit under it; * Updated Figure 9 Recommended PCB Land Pattern. 2019.01 V2.1 Added a note on the use of GPIO12 under Table 3, as well as in Section 4; Changed the RF power control range in Table 10 from -12 ~ +12 to -12 ~ +9 dBm. Updated the recommended operating temperature from -40 C ~ 65 C to -40 C 2018.11 V2.0 ~ 85 C. Updated Chapter 6: Schematics, where C18 is changed from a 1 F capacitor to a 4.7 F capacitor. 2018.10 V1.9 Added "Cumulative IO output current" entry to Table 5: Absolute Maximum Ratings; Added more parameters to Table 7: DC Characteristics. * Added certifications and reliability test items the module has passed in Table 2: ESP32-WROVER Specifications, and removed software-specific information; * Updated Section 3.4: RTC and Low-Power Management; * Changed the module's dimensions from (180.15) mm x (31.4 0.2) mm x (3.50.15) mm to (18.000.10) mm x (31.400.10) mm x (3.300.10) mm; 2018.08 V1.8 * Updated Figure 8: Physical Dimensions; * Updated Chapter 6: Schematics; * Changed the recommended operating temperature from -40C ~ 85C to - 40C ~ 65C and added a note to custom order of ESP32-WROVER with high temperature range; * Corrected a typo in Electrical Characteristics section; * Updated Table 8: Wi-Fi Radio. * Updated the capacity of PSRAM from 32 Mbit to 64 Mbit; * Deleted Temperature Sensor in Table 2: ESP32-WROVER Specifications; * Updated Chapter 3: Functional Description; * Updated Chapter 6: Schematics; * Added Chapter 9: Recommended PCB Land Pattern; 2018.06 V1.7 Changes to electrical characteristics: * Updated Table 5: Absolute Maximum Ratings; * Added Table 6: Recommended Operating Conditions; * Added Table 7: DC Characteristics; * Updated the values of "Gain control step", "Adjacent channel transmit power" in Table 10: Transmitter Characteristics - BLE. 2018.03 V1.6 Corrected typos in Table 3 Pin Definitions. 2018.03 V1.5 Updated Table 2 in Chapter 1. 2018.03 V1.4 Espressif Systems Updated Chapter 6 Schematics; Updated Chapter 8 Dimensions. 21 ESP32-WROVER Datasheet V2.2 Revision History Date Version Release notes Updated section 3.4 RTC and Low-Power Management; 2018.01 V1.3 Deleted information on LNA pre-amplifier; Updated section 3.4 RTC and Low-Power Management; Updated the ESP32-WROVER schematics in Chapter 6; Added a note in Chapter 7; Added the U.FL dimensions (Figure 10). Updated the description of the chip's system reset in Section 2.3 Strapping Pins; Deleted "Association sleep pattern" in Table "Power Consumption by Power Modes" 2017.10 V1.2 and added notes to Active-sleep and Modem-sleep; Added a note to Output Impedance in Table 8; Updated the notes to Figure 4 Peripheral Schematics. Updated Section 2.1 Pin Layout; 2017.09 V1.1 Updated the ESP32-WROVER Schematics and dded a note in Chapter 7; Added Chapter 8 Dimensions. 2017.08 V1.0 Espressif Systems First release. 22 ESP32-WROVER Datasheet V2.2